- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
Patent holdings for IPC class H01L 21/822
Total number of patents in this class: 2732
10-year publication summary
113
|
146
|
154
|
211
|
256
|
274
|
223
|
214
|
232
|
102
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
204 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
161 |
Panasonic Corporation | 20786 |
144 |
Murata Manufacturing Co., Ltd. | 22355 |
130 |
International Business Machines Corporation | 60644 |
111 |
Rohm Co., Ltd. | 5843 |
111 |
Sony Semiconductor Solutions Corporation | 8770 |
109 |
NEC Corporation | 32703 |
85 |
Socionext Inc. | 1575 |
79 |
Tokyo Electron Limited | 11599 |
76 |
Monolithic 3D Inc. | 270 |
70 |
Intel Corporation | 45621 |
56 |
Samsung Electronics Co., Ltd. | 131630 |
54 |
Fuji Electric Co., Ltd. | 4750 |
51 |
Sony Corporation | 32931 |
44 |
Fujitsu Limited | 19265 |
44 |
Sharp Kabushiki Kaisha | 18957 |
44 |
Renesas Electronics Corporation | 6305 |
39 |
Mitsubishi Electric Corporation | 43934 |
39 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
35 |
Other owners | 1046 |