• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology

Patent holdings for IPC class H01L 21/822

Total number of patents in this class: 2732

10-year publication summary

113
146
154
211
256
274
223
214
232
102
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Semiconductor Energy Laboratory Co., Ltd.
10902
204
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
161
Panasonic Corporation
20786
144
Murata Manufacturing Co., Ltd.
22355
130
International Business Machines Corporation
60644
111
Rohm Co., Ltd.
5843
111
Sony Semiconductor Solutions Corporation
8770
109
NEC Corporation
32703
85
Socionext Inc.
1575
79
Tokyo Electron Limited
11599
76
Monolithic 3D Inc.
270
70
Intel Corporation
45621
56
Samsung Electronics Co., Ltd.
131630
54
Fuji Electric Co., Ltd.
4750
51
Sony Corporation
32931
44
Fujitsu Limited
19265
44
Sharp Kabushiki Kaisha
18957
44
Renesas Electronics Corporation
6305
39
Mitsubishi Electric Corporation
43934
39
Panasonic Intellectual Property Management Co., Ltd.
27812
35
Other owners 1046